QML Class V designation acknowledges distinctive reliability and longevity for vital house missions Satisfying mission assurance necessities for essentially the most vital house packages, Microchip Expertise’s Radiation-Tolerant (RT) RTG4 Area- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Certified Producers Checklist (QML) Class V standing. As designated by the Protection Logistics Company (DLA), QML Class V is the very best stage of qualification for house parts and a obligatory step to fulfill mission assurance necessities on essentially the most vital house missions resembling human-rated, deep house and nationwide safety packages. As a result of QML {qualifications} are standardized primarily based on particular efficiency and high quality necessities ruled by the DLA, prospects can streamline their design and certification processes through the use of QML- certified merchandise.
In 2018, RTG4 FPGAs grew to become the primary RT FPGAs providing greater than 150,000 logic components to realize a QML Class V qualification, and this next-generation resolution with lead-free flip-chip bumps is the primary of its sort to realize QML Class V standing. In superior flip-chip bundle building, resembling that used within the RTG4 FPGA, flip-chip bumps are utilized to attach the silicon die and the bundle substrate. Lead- free bump materials will assist prolong the longevity of the product, which is vital to house missions.
“That is one other milestone for our RTG4 FPGAs that may present prospects with added confidence in designing these gadgets in house flight techniques, whereas permitting them to reap the benefits of our high- reliability, zero-configuration-upset and low-power consumption FPGAs,” mentioned Bruce Weyer, company vp for Microchip’s FPGA enterprise unit. “For greater than 60 years, Microchip options have powered house flight missions, and we’re devoted to product longevity and offering the very best high quality options.”
RTG4 FPGAs are designed to convey excessive ranges of density and efficiency to house functions, saving value and engineering efforts by way of low energy consumption and immunity to configuration upsets. In contrast to SRAM-based FPGA options, the programming expertise utilized in RTG4 FPGAs offers low static energy, which assists in managing thermal points widespread in spacecraft. RTG4 FPGAs devour solely a fraction of the full energy in comparison with equal SRAM FPGAs, whereas exhibiting zero configuration upsets in radiation and thus requiring no mitigation, lowering engineering bills and complete system prices.
To attain QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone intensive reliability testing, enduring as much as 2,000 thermal cycles from −65ºC to 150°C junction temperature. The lead-free flip-chip bump interface connections handed MIL-PRF-38535 inspection standards and exhibited no indicators of tin whiskers. The flip-chip bump is contained in the FPGA bundle, so there isn’t a affect on the consumer’s design, reflow profile, thermal administration or board meeting movement when changing to lead-free bump RTG4 FPGAs.
Microchip boasts one of many business’s most complete house product portfolios of radiation- hardened and RT options that embody QML Class Q RT PolarFire FPGAs and sub-QML FPGAs that bridge the hole between conventional Certified Producers Checklist (QML) parts and Business Off-The- Shelf (COTS) parts. For a complete itemizing of Microchip FPGA and mixed-signal half numbers alongside their corresponding Protection Logistics Company (DLA) drawing numbers, please discuss with the DLA Cross Reference Information.
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The RTG4 FPGAs are supported by improvement kits, mechanical samples and daisy chain packages for board validation and testing. Libero SoC Design Suite permits RTL entry by way of programming and features a wealthy IP library, full reference designs and improvement kits.
